- 3D Printing
- Artificial Intelligence/Machine Learning
- Audio/Video Processing
- Battery Charging
- Circuit Protection
- Data Conversion
- Data Storage
- Display Systems
- Embedded Processing
- Energy Harvesting
- Energy Storage
- Eval/Dev Tool
- General Purpose
- Human Interface
- Industrial Automation
- Industrial Control
- IoT Internet of Things
- Motor Control
- Optical Communication
- PCB Design & Fabrication
- Power Management
- RF/EMI Shielding
- Signal Processing
- Single Board Computer
- Thermal Management
- Timing & Clock Management
- Wired Communication
- Wireless Communication
Amphenol Advanced Sensors' Thermometrics pressure and temperature combination sensor provides both pressure and temperature measurements in one sensor assembly.
Analog Devices' MAX9865 digital audio interface automatically recognizes different PCM and TDM clocking schemes.
STMicroelectronics' VNF1048F device is an advanced controller for a power MOSFET designed for the implementation of an intelligent high-side switch.
Analog Devices' MAX77857 buck-boost high-efficiency converter operates in PWM mode and implements an automatic SKIP mode to improve light-load efficiency.
Analog Devices' ADMV8526 digitally tunable band-pass filter's compact size and flexible tunability simplify design and reduce engineering development time.
Littelfuse’s AQ7520-08UTG/SC7520-08UTG series 0.32 pF 12 kV diode arrays can safely absorb repetitive ESD strikes without performance degradation.
Klein Tools’ 7-piece flip impact socket set includes ten sizes combined into five sockets and two nested adapters.
Klein’s flip impact socket combines two socket sizes in one and is designed for use with an impact driver.
onsemi's AXM0F343 contains the AX5043 RF transceiver and a powerful Arm® Cortex®-M0+ MCU, making it an excellent choice for IoT applications.
TE Connectivity’s M12 power L-code panel mount PCB connectors provide a compact solution for high-power connections in automation devices.
TE Connectivity's next-generation 2 mm pitch Signal GRACE INERTIA connector is offered in both crimp and IDC options with advanced features and materials.
TE Connectivity's hybrid board receptacles and cordsets standardize the transmission of Ethernet over only one pair of copper wires.
Laird's Ttape pressure sensitive adhesive tape is designed to facilitate the transfer of thermal energy from heat sources, such as IC chips, to heat sinks.
Challenge Electronics' mobile speakers are designed to provide crystal clear voice and music reproduction in an IP-rated or SMT reflow capable package.