Product Highlights

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ATS thermal solutions for NVIDIA® Jetson THOR™ SoMs feature ready-to-install mounting hardware and thermal interface material.

New Product

Advanced Thermal Solutions cooling solutions for the AMD Kria™ K24 SOM deliver advanced, versatile thermal management across all potential power levels.

The ATS-THCP-1000 is a state-of-the-art dual-sided, high-flow cold plate engineered by ATS to provide exceptional thermal management for high-power electronics.

ATS high-performance heat sinks are designed for the NVIDIA® Jetson™ modules widely used in autonomous machines and other embedded and edge applications.

ATS’ high-performance fanSINK™ with a superGRIP™ heat sink attachment is designed for ADI evaluation boards for AD9166, AD9986/8, AD9081/2, and quad-MxFE.

ATS' heat pipe bender is a precision engineering tool designed to give engineers and technicians accurate and thermally reliable heat pipe bends.

ATS PCIe® extrusion profiles are off the shelf solutions specifically for the thermal management of PCIe cards.

Advanced Thermal Solutions' heat sink attachments give engineers multiple options to mechanically attach almost any heat sink to PCBs.

Advanced Thermal Solutions' tubed cold plate family is engineered as a cost-effective and reliable solution for liquid cooling thermal management applications.

Advanced Thermal Solutions' DIY family of high-performance cold plates provides engineers with the freedom to drill holes to match specific connection points.

Advanced Thermal Solutions’ dualFLOW and quadFLOW coolers provide at least 20% improvement in thermal performance when compared to other CPU coolers.

Advanced Thermal Solutions’ high-performance passive coolers are designed to take advantage of system airflow to cool high-powered processors.

Check out Advanced Thermal Solutions wide array of heat sinks including the largest selection of pushPIN™ heat sinks on the market to cover your board.

ATS' ATS-CP series IGBT (Insulated Gate Bipolar Transistor) cold plates have unmatched thermal performance because of their mini-channel fin design.

ATS’ tube-to-fin, liquid-to-air heat exchangers are made with the industry's highest density fins to maximize the heat transfer from liquid to air.

ATS’ portable chiller series are re-circulating chillers are vapor-compression based systems that provide chilled fluid for cooling purposes.

ATS has produced a broad array of high performance heat sinks, based off of the patented maxiFLOW™ design.

ATS aluminum extrusions are cost-effective profiles that enable engineers to design from a pre-tooled extrusion profile for the cooling solution.

ATS has introduced its stamped heat sinks, or board level cooling solutions, specifically designed to cool power modules that come in a variety of TO packages.

Copper heat pipes from Advanced Thermal Solutions offer high thermal conductivity and are available in round or flat styles.